Release Time:2023/10/27 Number Of Clicks:604

TAICENN, October 2023

TAICENN launched the first RISC architecture-based Android OS industrial Panel PC TPC-DCSxxxR2 series, which supports Rockchip RK3568 Soc and Mali-G52 GPU, and has strong computing processing capabilities and scalability. Its modular concept, true flat panel and multi-point capacitive touch design can be integrated with existing HMI/MES systems and flexibly deployed to meet the application needs of different industrial scenarios.

It adopts TAICENN's consistent modular design and manufacturing concept. It is modular designed and manufactured by standard TM-PC series multi-point capacitive touch display modules and new Android PC modules. It supports full dimensions: 10.4”, 12.1”, 15.0”, and widescreen 15.6”, 17.0”, widescreen 18.5”, 19.0”and widescreen 21.5”.This new series of Android industrial Panel PC supports Wi-Fi wireless function by default, can support 3G/4G and 5G communications, supports Android 11 and Linux operating systems, and is suitable for various types of industrial applications, such as machine-to-machine (M2M) applications, Building Automation, industrial Internet of Things (IIoT), intelligent manufacturing and MES, service robots, commercial automation etc.

Outstanding performance – ARM Rockchip RK3568
RK3568 is a middle/High level SoC produced by Rockchip. It adopts 22nm advanced process technology and integrates 4-Cores ARM architecture A55 processor and Mali G52 2EE GPU. It supports 4K decoding and 1080P encoding. Compare to RK3399, RK3568 CPU have higher CPU frequency, up to 2.0Ghz; The Mali-G52 GPU has better graphics processing capabilities and higher efficiency than Mali-T860 on RK3399.
RK3568 adopts a new generation of NPU (neural network processor) architecture. Compared with the NPU of RK3399, the NPU performance of RK3568 is more powerful. Specifically, the NPU of RK3568 supports multiple data types such as INT8/INT16/FP16, and the computing power can reach 1TOPS.
Compared to RK3399, RK3568 has obvious advantages in AI performance and can better support various AI application scenarios.
Rich IOs and expansions - meet different industrial needs
In terms of input and output IO interfaces, the TPC-DCxxxR2 series is designed with rich IO interfaces to meet the actual needs of customers on site. It supports 2 GbE network, 1 USB3.0, 3 USB2.0, and 2 COMports (COM1 can be configured to set RS232/RS485; COM2 defaults to RS232, optional RS485 or GPIO), and 1 HDMI HQ video display interface, optional 2 high-speed expansion slots, 3G/4G (Mini-PCIe) and 5G (M.2 3052) wireless capabilities. In terms of structure and heat dissipation, the TPC-DCSxxxR2 series adopts a high-strength aluminum-magnesium alloy structure, a fanless design structure, Panel mount and standard VESA 75/100 mount; DC terminal 12V by default, and optionally supports wide DC 9~36V power input range.

Main features:
 High strength aluminum alloy, anodized and painting treatment;
 Full Dimension: 10.4”,12.1”,15.0”, 15.6”WXGA, 15.6”FHD, 17.0”, 18.5”WXGA, 18.5”FHD, 19.0” and 21.5”FHD;
 On-board ARM Rockchip RK3568, Quad-core Cortex-A55, up to 2.0Ghz;
 Multi-points, up to 10 points Pcap. Touchscreen, EETI controller;
 DC Terminal 12V input, optional wide voltage DC 9~36V input;
 2 GbE, 1 USB3.0, 3 USB2.0, 2 COM, 1 HDMI, Audio;
 Support Wi-Fi, optional support 3G/4G, and 5G wireless communication;
 True flat designed, Panel mount, support VESA 75/100 mount;
 Fanless design, slim design, front IP65 rated protection.

Product Image:
Delivery plan:

In our schedule, TPC-DCSxxxR2 series products have been validated by our engineer team, and are above to deliver small and middle batch at this moment. Any further information, welcome to contact with TAICENN sales team.